SWIR

 

Xeva-1.7-320 TE3

Xeva-1.7-320 TE3 Image

Advanced research in SWIR imaging

Stable TE3-cooled SWIR research where every photon counts

In one compact housing, the Xeva-1.7-320 TE3 digital camera combines a thermo-electrically cooled InGaAs detector head and the control and communication electronics.

The Xeva-1.7-320 TE3 unit is available with standard (up to 1.7 μm) InGaAs detector arrays and comes in various speed versions: 60 Hz, 100 Hz and 350 Hz. It allows you to choose the most suitable detector-camera configuration for your specific application.

The camera head interfaces to a PC via standard USB 2.0 or CameraLink.

Each camera is delivered with agraphical user interface Xeneth, which offers direct access to various camera settings such as exposure time and operating temperature. The software tools include two-point uniformity correction and bad pixel replacement.

 

Benefits & features

  • Spectrometer compatible
    These cameras have mounting holes for spectrographs, making them suitable for (hyper)spectral imaging applications
  • Thermal imaging of hot objects
  • High sensitivity for low-light conditions
  • Extending SWIR imaging to the visible
  • Cooled operation for low light-level imaging
  • Flexible programming in an open architecture
  • CameraLink and triggering for high speed imaging
  • Extended coverage from SWIR into the visible range

Designed for use in

  • Wafer inspection
  • R&D (SWIR range)
  • Hyperspectral imaging
  • Low-light-level analysis
  • Semiconductor inspection
  • Solar cell inspection EL/PL
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Xeva-1.7-320 TE3

Xeva-1.7-320 TE3 Image

Advanced research in SWIR imaging

Stable TE3-cooled SWIR research where every photon counts

In one compact housing, the Xeva-1.7-320 TE3 digital camera combines a thermo-electrically cooled InGaAs detector head and the control and communication electronics.

The Xeva-1.7-320 TE3 unit is available with standard (up to 1.7 μm) InGaAs detector arrays and comes in various speed versions: 60 Hz, 100 Hz and 350 Hz. It allows you to choose the most suitable detector-camera configuration for your specific application.

The camera head interfaces to a PC via standard USB 2.0 or CameraLink.

Each camera is delivered with agraphical user interface Xeneth, which offers direct access to various camera settings such as exposure time and operating temperature. The software tools include two-point uniformity correction and bad pixel replacement.

 

Benefits & features

  • Spectrometer compatible
    These cameras have mounting holes for spectrographs, making them suitable for (hyper)spectral imaging applications
  • Thermal imaging of hot objects
  • High sensitivity for low-light conditions
  • Extending SWIR imaging to the visible
  • Cooled operation for low light-level imaging
  • Flexible programming in an open architecture
  • CameraLink and triggering for high speed imaging
  • Extended coverage from SWIR into the visible range

Designed for use in

  • Wafer inspection
  • R&D (SWIR range)
  • Hyperspectral imaging
  • Low-light-level analysis
  • Semiconductor inspection
  • Solar cell inspection EL/PL
View Fullscreen